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? 適用領(lǐng)域： ?集成電路、先進封裝 Relevant Industries: Integrated Circuits, Advanced Packaging ? 適用材料: ?Si、SiC Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ?晶圓尺寸: ?12/8/6英寸 Wafer Size: 12/8/6 inch ?適用工藝: ?氧化(Oxidation)、退火(Annealing)、固化(Polyimide)、合金(Alloy)、擴散(Diffusion) Applicable Processes: ?Oxidation, Annealing, Polyimide Curing, Alloy, Diffusion